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US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Jan. 27 for "Packaging method and associated packaging structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,534,361, issued on Jan. 27, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Packaging method and associated... Read More


US Patent Issued to CLEARMIND BIOMEDICAL on Jan. 27 for "Medical device" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,533,011, issued on Jan. 27, was assigned to CLEARMIND BIOMEDICAL INC. (San Jose, Calif.). "Medical device" was invented by Sheng-Chi Lin (New T... Read More


US Patent Issued to Infirst Healthcare on Jan. 27 for "Compositions and methods for treating chronic inflammation and inflammatory diseases" (British Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,533,332, issued on Jan. 27, was assigned to Infirst Healthcare Ltd. (London). "Compositions and methods for treating chronic inflammation and i... Read More


US Patent Issued to Micron Technology on Jan. 27 for "Apparatus with speed selection mechanism and method for operating" (Idaho Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,537,724, issued on Jan. 27, was assigned to Micron Technology Inc. (Boise, Idaho). "Apparatus with speed selection mechanism and method for ope... Read More


US Patent Issued to LG Chem on Jan. 27 for "Encapsulation film, organic electronic element comprising the same, and method for manufacturing thereof" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,649, issued on Jan. 27, was assigned to LG Chem Ltd. (Seoul, South Korea). "Encapsulation film, organic electronic element comprising the s... Read More


US Patent Issued to G-QUEST on Jan. 27 for "Thermosensitive sensor" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,535,365, issued on Jan. 27, was assigned to G-QUEST Co. LTD. (Atsugi, Japan). "Thermosensitive sensor" was invented by Ken Odashiro (Atsugi, Ja... Read More


US Patent Issued to GENERAL ELECTRIC on Jan. 27 for "Combustion section for a turbine engine" (Indian, American, German Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,535,216, issued on Jan. 27, was assigned to GENERAL ELECTRIC COMPANY (Evendale, Ohio). "Combustion section for a turbine engine" was invented b... Read More


US Patent Issued to Illinois Tool Works on Jan. 27 for "Door handle assembly" (Chinese Inventor)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,534,943, issued on Jan. 27, was assigned to Illinois Tool Works Inc. (Glenview, Ill.). "Door handle assembly" was invented by Penghui Yi (Shang... Read More


US Patent Issued to Infineon Technologies on Jan. 27 for "Molded package having an electrically conductive clip with a convex curved surface attached to a semiconductor die" (Malaysian, Austrian Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,810, issued on Jan. 27, was assigned to Infineon Technologies AG (Neubiberg, Germany). "Molded package having an electrically conductive cl... Read More


US Patent Issued to SHIN-ETSU CHEMICAL on Jan. 27 for "Material for forming adhesive film, patterning process, and method for forming adhesive film" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,535,737, issued on Jan. 27, was assigned to SHIN-ETSU CHEMICAL Co. LTD. (Tokyo). "Material for forming adhesive film, patterning process, and m... Read More